The full report by Tech Insights is paywalled, but the company shared a number of slides and details with EETimes. The HBM assembly that AMD and Hynix jointly designed is genuinely new compared to other products on the market. Samsung has used TSVs (through silicon vias) for wiring DRAM together before, but no one has ever built a wide I/O design like this in a commercial product.
Thursday, 30 July 2015
Deep dive: Hynix’s High Bandwidth Memory
The full report by Tech Insights is paywalled, but the company shared a number of slides and details with EETimes. The HBM assembly that AMD and Hynix jointly designed is genuinely new compared to other products on the market. Samsung has used TSVs (through silicon vias) for wiring DRAM together before, but no one has ever built a wide I/O design like this in a commercial product.
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